What is the recommended footprint for MIC33153 with MLF® package?

The term MLF® (for MicroLeadFrame®) is proprietary to Amkor Technology®. The equivalent term for our packaging options are DFN for Dual Flatpack No-lead, or QFN for Quad Flatpack No-Leads.

Please refer to the "HJDFN" section of the "Packaging Specification" for the recommended land pattern.

  Return to Top

© 2023 Microchip Technology, Inc.
Notice: ARM and Cortex are the registered trademarks of ARM Limited in the EU and other countries.
Information contained on this site regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.