Debug Header Target Footprints

To connect a debug header directly to a target board (without the use of a transition socket) the following information will be helpful.

DIP Device Footprints

DIP device adapter footprints shown will accept adapter plugs like Samtec series APA plugs. These plugs can be soldered into place during development/emulation and eliminate the need for any other sockets.

Figure: DIP Footprint
HeaderX_4_2_1.jpg

TQFP/PLCC Device Footprints

TQFP/PLCC device adapter footprints shown will accept board stackers like Samtec series DWM 0.050 Pitch Stackers. These stackers can be soldered into place during development/emulation and eliminate the need for any other sockets.

Figure: Single-Row TQFP/PLCC Footprint
HeaderX_4_3_1.jpg

Figure: Double and Triple-Row TQFP/PLCC Footprint
HeaderX_4_3_2.jpg

Header pin-out matches the PLCC package. PLCC will map to TQFP as follows:

  • Header to 44-pin TQFP – one-to-one mapping.
  • Header to 64-pin TQFP – see "Figure: Header to 64-Pin TQFP" for mapping.
  • Header to 80-pin TQFP – see "Figure Header to 80-Pin TQFP" for mapping.
  • Header to 100-pin TQFP – one-to-one mapping.
Figure: Header to 64-Pin TQFP
HeaderX_4_3_3.jpg


Figure: Header to 80-Pin TQFP
HeaderX_4_3_4.jpg

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